AMAT 0010-23716 Vacuum pump interface module

AMAT 0010-23716: Technical Specifications

1. Component Type
   • Category: Vacuum Pump Interface Module or High-Precision Pressure Control Valve
   • Function: Manages vacuum levels and gas flow between the process chamber and exhaust systems.
   • Material: Stainless steel (316L), aluminum alloy, and high-temperature elastomers (e.g., Viton® or Kalrez® seals) for chemical resistance.
2. Physical Specifications
   • Dimensions: Compact modular design (approx. 200 mm × 150 mm × 80 mm) for integration into cluster tools.
   • Weight: 2.0–3.5 kg (optimized for ease of installation and maintenance).
3. Operating Parameters
   • Pressure Range: 
     • High Vacuum: ≤ 10⁻⁶ Torr (compatible with turbo-molecular pumps).
     • Process Pressure: Adjustable from 10⁻³ Torr to 10 Torr for dynamic process control.
   • Temperature Tolerance: -40°C to 200°C (operational), with thermal shielding for stability.
   • Flow Rate: Up to 500 standard liters per minute (SLM) for rapid chamber evacuation.
4. Compatibility
   • Process Gases: Compatible with inert (Ar, N₂), corrosive (Cl₂, HBr), and pyrophoric (SiH₄, WF₆) gases.
   • Tool Integration: Designed for AMAT Endura® or Producer® platforms.
   • Connections: ISO-KF or CF flanges with metal gaskets for leak-tight sealing (helium leak rate < 1×10⁻⁹ mbar·L/s).
5. Control & Automation
   • Actuation: Pneumatic or electric actuator for precise valve positioning (±0.1% accuracy).
   • Sensors: Integrated pressure transducers for real-time feedback to the tool’s PLC (Programmable Logic Controller).
6. Certifications & Standards
   • Complies with SEMI F57-0307 (particle and contamination control).
   • RoHS/REACH compliant (hazardous substance-free).
7. Lifetime & Maintenance
   • Service Life: ~5–8 years under standard operating conditions (depends on gas aggressiveness and cycle frequency).
   • Maintenance: Replace seals annually; lubricant-free design minimizes particle generation.

Functional Overview

The AMAT 0010-23716 is a critical component for maintaining precise vacuum and gas flow control in semiconductor manufacturing processes. Key functionalities include:

1. Dynamic Vacuum Control
   • Enables rapid pump-down and precise pressure adjustments during chamber transitions (e.g., load-lock to process chamber).
   • Ensures stable process environments for etching, deposition, or implantation steps.
2. Process Stability
   • Minimizes pressure fluctuations (<±0.5% deviation) during critical steps (e.g., ALD cycles or high-aspect-ratio etches).
   • Prevents backflow of contaminants into the chamber via fail-safe valve mechanisms.
3. Corrosion Resistance
   • Engineered for compatibility with aggressive chemistries (e.g., HCl, O₃) used in advanced node fabrication.
4. High Throughput
   • Supports fast chamber evacuation and refill cycles, reducing wafer process time in high-volume manufacturing.
5. Applications
   • Dielectric Etch: Oxygen-based plasmas for organic film removal.
   • Metal Deposition: Precise pressure control during PVD (sputtering) of Cu or Al interconnects.
   • Chamber Cleaning: Manages exhaust flows during NF₃ plasma cleans.

Critical Notes

• Safety: This component may interface with hazardous gases; ensure adherence to AMAT’s safety protocols (e.g., gas detection systems and purge routines).
• Calibration: Requires periodic alignment with the tool’s pressure sensors to maintain accuracy.