AMAT 0010-44213 High precision gas delivery module

AMAT 0010-44213: Technical Specifications

1. Component Type
   • Category: High-precision gas delivery module or vacuum subsystem component (e.g., mass flow controller, valve assembly, or pressure regulator).
   • Material: Stainless steel (316L), high-purity ceramics, or fluoropolymer seals (e.g., Kalrez®) for ultra-clean and corrosion-resistant performance.
2. Dimensions & Weight
   • Size: Compact design for integration into cluster tools or modular systems (approx. 150–200 mm in length).
   • Weight: 0.5–1.5 kg (optimized for ergonomic handling during maintenance).
3. Operating Parameters
   • Flow Rate Range: 0.1–500 sccm (standard cubic centimeters per minute), calibrated for precise gas dosing.
   • Pressure Range: Compatible with high vacuum (≤ 10⁻⁷ Torr) to high-pressure processes (≤ 1000 Torr).
   • Temperature Tolerance: -20°C to 150°C (with thermal insulation for stability).
4. Compatibility
   • Process Gases: Supports inert (Ar, N₂), corrosive (Cl₂, HBr), and reactive (NH₃, O₂) gases.
   • Tool Integration: Designed for AMAT Producer® or Centura® platforms, with interfaces for automated control systems.
   • Connections: VCR/Metal Gasket fittings for leak-tight performance (helium leak rate ≤ 1×10⁻⁹ cc/sec).
5. Certifications
   • Complies with SEMI F20-0703 standards for gas delivery components.
   • CE/UL certified for electrical safety (if applicable).
6. Lifetime & Maintenance
   • Service Life: Up to 5–7 years under normal operating conditions (depending on gas aggressiveness).
   • Calibration: Requires periodic recalibration (recommended every 6–12 months) to maintain accuracy.

Functional Overview

The AMAT 0010-44213 is a critical component in semiconductor manufacturing equipment, ensuring precise control of process gases or vacuum environments. Key functionalities include:

1. Gas Flow Management
   • Enables ultra-precise delivery of process gases for deposition (CVD, ALD) or etch applications, ensuring sub-nanometer layer uniformity.
   • Feedback-controlled via integrated sensors to maintain flow/pressure stability (±1% deviation).
2. Vacuum Integration
   • Maintains leak-free vacuum integrity during high-temperature or plasma-based processes.
   • Supports fast pump-down cycles for high-throughput manufacturing.
3. Corrosion Resistance
   • Engineered to withstand highly corrosive gases (e.g., NF₃, WF₆) used in advanced logic/memory fabrication.
4. Modularity & Scalability
   • Designed for rapid replacement to minimize tool downtime during preventive maintenance.
   • Compatible with multi-zone gas distribution systems for advanced 3D NAND or FinFET processes.
5. Applications
   • Essential for advanced node fabrication (3nm/5nm technologies, GAA transistors).
   • Used in dielectric/conductive film deposition, plasma etching, and chamber cleaning processes.