AMAT 0190-07970 Precision linear actuator

AMAT 0190-07970: Technical Specifications

1. Component Type
   • Category: Wafer Transfer Robot or Precision Linear Actuator
   • Purpose: Enables high-speed, contamination-free wafer handling between chambers in cluster tools or load-lock systems.
   • Material: Carbon fiber-reinforced composite (for rigidity and lightweight design) with ceramic-coated grippers for particle-free operation.
2. Physical Specifications
   • Travel Range: 500–800 mm (compatible with 300mm wafer platforms).
   • Speed: Up to 2 m/s with positional accuracy of ±0.05 mm.
   • Payload Capacity: 5–8 kg (supports multiple wafers or dummy substrates).
   • Weight: 4–6 kg (optimized for rapid acceleration/deceleration).
3. Environmental Tolerance
   • Vacuum Compatibility: Operates in high-vacuum environments (≤ 10⁻⁷ Torr).
   • Temperature Range: -20°C to 120°C (with thermal shielding for process chambers).
   • Cleanliness: ISO Class 1 particle standards for front-end fabrication.
4. Control & Integration
   • Degrees of Freedom: 4-axis control (X, Y, Z, θ) for precise alignment with chambers.
   • Tool Compatibility: AMAT Endura® or Centura® platforms.
   • Sensors: Optical encoders and laser alignment systems for closed-loop motion control.
   • Communication: SECS/GEM or Ethernet/IP protocols for integration with fab automation.
5. Certifications & Standards
   • Compliant with SEMI S2/S8 (safety) and SEMI E178 (robotic repeatability).
   • RoHS/REACH compliant.
6. Lifetime & Maintenance
   • Service Life: 5–7 years (or 1.5 million transfer cycles), depending on duty cycle.
   • Maintenance: Monthly inspection of belts/bearings; annual calibration of motion sensors.

Functional Overview

The AMAT 0190-07970 is a critical component in semiconductor manufacturing tools, ensuring rapid and reliable wafer transfers in vacuum or inert environments. Key functionalities include:

1. High-Throughput Wafer Handling
   • Transfers wafers between load locks, process chambers, and metrology stations with sub-millisecond synchronization, minimizing cycle time and maximizing tool utilization.
2. Precision Alignment
   • Achieves ±0.05 mm positioning accuracy to align wafers with process chambers, critical for nanoscale patterning (e.g., EUV lithography overlay).
3. Particle Control
   • Minimizes contamination through non-shedding materials and electrostatic discharge (ESD)-safe grippers.
4. Vacuum-to-Atmosphere Transitions
   • Supports fast pump-down and vent cycles for cluster tools, enabling multi-step processes (e.g., etch-deposition-clean) without breaking vacuum.
5. Applications
   • Logic/DRAM Fabrication: Transfers wafers in 3nm/5nm node processes.
   • 3D NAND Stacking: Handles thick wafers during high-aspect-ratio via etching.
   • Advanced Packaging: Positions wafers for hybrid bonding or through-silicon via (TSV) integration.