AMAT 0190-27952 Chamber isolation valve

AMAT 0190-27952: Technical Specifications

1. Component Type
   • Category: Chamber Isolation Valve or Vacuum Gate Valve
   • Purpose: Controls access between adjacent chambers or vacuum modules in cluster tools, maintaining pressure differentials and preventing cross-contamination.
   • Material: Stainless steel (316L) body with elastomer-free seals (e.g., metal seals for ultra-high vacuum) or Kalrez®/Viton® gaskets for chemical resistance.
2. Physical Specifications
   • Valve Diameter: 150–250 mm (matched to chamber port sizes).
   • Stroke Length: 20–50 mm (pneumatic or electric actuation).
   • Weight: 3–7 kg (compact design for easy integration).
3. Operational Parameters
   • Vacuum Range: High vacuum (≤ 10⁻⁸ Torr) to atmospheric pressure.
   • Temperature Range: -50°C to 250°C (with thermal isolation for hot processes).
   • Cycle Life: 100,000–500,000 cycles (depending on seal type and actuation speed).
4. Actuation & Control
   • Drive Mechanism: Pneumatic (air-over-oil) or electric servo motor.
   • Response Time: <1 second for full open/close cycles.
   • Feedback Sensors: Position sensors and limit switches for real-time status monitoring.
5. Compatibility
   • Process Gases: Compatible with inert (Ar, N₂), corrosive (Cl₂, HBr), and flammable (H₂, SiH₄) gases.
   • Tool Integration: Designed for AMAT Endura® or Centura® cluster tools.
   • Connections: ISO-KF, CF, or VAT-style flanges for leak-tight sealing.
6. Certifications & Standards
   • Compliant with SEMI S2/S8 (safety) and SEMI F51 (cleanliness).
   • CE/UL-certified for electrical components (if applicable).
7. Lifetime & Maintenance
   • Service Life: 5–10 years (varies with cycling frequency and gas environment).
   • Maintenance: Annual seal inspection and lubrication (if required); replace consumable seals every 2–3 years.

Functional Overview

The AMAT 0190-27952 is critical for maintaining process integrity and vacuum stability in semiconductor manufacturing tools. Key functionalities include:

1. Chamber Isolation
   • Seals individual process chambers during high-pressure or plasma steps (e.g., etch, deposition), preventing gas/particle migration between modules.
2. Vacuum Integrity
   • Ensures leak-tight operation (helium leak rate ≤ 1×10⁻⁹ mbar·L/s) to sustain ultra-high vacuum (UHV) conditions for sensitive processes (e.g., ALD, MBE).
3. Process Flexibility
   • Enables sequential multi-step processes (e.g., etch → clean → deposition) without breaking vacuum, reducing contamination risks and cycle time.
4. Safety Features
   • Fail-safe “closed” position during power/pneumatic failure to protect wafers and tool components.
   • Integrated interlock systems to prevent accidental actuation during maintenance.
5. Applications
   • Advanced Logic/DRAM Fabrication: Controls wafer transfer between lithography, etch, and deposition modules.
   • 3D NAND: Maintains vacuum isolation during multilayer stack processing.
   • Metal Deposition: Prevents cross-contamination during PVD/CVD of Cu, Al, or barrier layers.