Introduction to EMEROSN MVME61006E-0163R
Product Description
The EMEROSN MVME61006E-0163R is a rugged, high-performance embedded single-board computer (SBC) designed for mission-critical industrial automation, aerospace, defense, and energy applications. As part of EMEROSN’s MVME (Modular Versatile Multiprocessor Executive) series—renowned for reliability in harsh environments—this SBC integrates a powerful processing core, flexible I/O, and robust environmental resilience, making it ideal for applications requiring deterministic performance, long-term availability, and compatibility with legacy industrial systems.
The model designation “MVME61006E-0163R” encodes key attributes: “MVME” denotes the product family, “61006E” specifies the hardware generation (6th-gen) with enhanced I/O and processing capabilities, and “0163R” references a region-specific configuration (e.g., North American compliance) with redundant power support. Unlike commercial SBCs, the MVME61006E-0163R is engineered to operate in extreme conditions—including wide temperature ranges, high vibration, and electromagnetic interference (EMI)—while delivering consistent performance for tasks such as real-time control, data acquisition, and embedded computing in industrial controllers, process automation systems, or ruggedized test equipment.
Typical use cases include:
- Real-time control of industrial robots in automotive manufacturing.
- Data processing for oil and gas wellhead monitoring systems (exposed to extreme temperatures and vibration).
- Embedded computing in aerospace ground support equipment, requiring long-term hardware availability (10+ years).
- Deterministic logic execution in power grid management systems, where latency and reliability directly impact operational safety.
Technical Parameters
- Processor and Core Performance:
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- CPU: Dual-core industrial-grade ARM Cortex-A53 (1.5 GHz) or Intel Atom E3950 (1.6 GHz, burst up to 2.0 GHz)—optimized for low power consumption (≤15W) and deterministic task execution.
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- Coprocessor: Integrated FPGA (Xilinx Artix-7 or equivalent) for custom I/O timing, signal processing, or legacy protocol emulation (e.g., VMEbus, MIL-STD-1553).
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- Memory:
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- RAM: 4 GB DDR4 SDRAM (ECC, error-correcting code) for data integrity in critical applications; expandable to 8 GB via solder-down modules.
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- Storage: 32 GB industrial-grade eMMC flash (for firmware/OS); 1x SATA III interface (supports 2.5” SSD/HDD, up to 2 TB).
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- Non-volatile Storage: 128 KB FRAM (ferroelectric RAM) for persistent data retention (no battery required) and 1x microSD slot (for field-upgradable firmware).
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- I/O and Communication Interfaces:
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- Industrial Communication:
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- 2x Gigabit Ethernet ports (10/100/1000BASE-T, IEEE 802.3, supports Modbus TCP/IP, Ethernet/IP, PROFINET IRT for real-time automation).
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- 2x RS485/RS232 serial ports (configurable via software, supports Modbus RTU, DNP3.0 for legacy sensor connectivity).
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- 1x CANopen port (ISO 11898-2) for automotive/industrial bus communication.
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- Optional: 1x MIL-STD-1553B interface (for aerospace applications) or 1x Profibus-DP port (via FPGA expansion).
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- Digital I/O:
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- 16-channel configurable digital I/O (8 inputs/8 outputs, 24V DC, PNP/NPN, 500µs response time) with edge-detection and interrupt capabilities.
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- 2x PWM outputs (up to 1 MHz) for motor control or timing signals.
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- Analog I/O:
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- 8-channel analog input (12-bit resolution, 0–10V or 4–20mA, ±0.1% accuracy at 25°C).
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- 2-channel analog output (12-bit resolution, 0–10V or 4–20mA).
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- Expansion Interfaces:
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- 1x PCI Express x4 slot (for add-on cards: GPU, additional Ethernet, or specialty I/O).
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- 1x VMEbus interface (compatible with legacy MVME modules, supporting 32-bit/33MHz transfers).
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- Power Supply:
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- Input Voltage: 12–24V DC (wide-range, 9–36V DC tolerant) with redundant power inputs (for fault tolerance in critical systems).
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- Power Consumption: ≤15W (typical, at full CPU load and 25°C); ≤20W (peak, with all I/O active).
- Environmental and Mechanical Ratings:
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- Temperature: Operating: -40°C to +85°C (extended temperature range, no forced cooling required); Storage: -55°C to +125°C.
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- Vibration: 10–2000 Hz, 10g peak (random vibration, IEC 60068-2-64); 30g peak (shock, 11ms duration, IEC 60068-2-27).
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- EMI/EMC Compliance: MIL-STD-461G (for aerospace/defense), EN 61000-6-2 (industrial EMC), FCC Part 15 Class A.
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- Protection Rating: IP30 (board-level); IP65 when integrated into EMEROSN’s rugged enclosure (model: RUG-MVME-6100).
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- Dimensions: 160mm × 100mm (standard 3U VME form factor, compatible with 19-inch racks or custom enclosures).
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- Weight: 280g (board-only); 550g (with heat sink).
- Certifications:
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- Industrial: UL 508 (industrial control equipment), CE (EN 61000-6-2/4), RoHS 2.0.
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- Aerospace/Defense: MIL-STD-810H (environmental engineering), AS9100 (aerospace quality management).
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- Safety: IEC 61508 SIL 2 (functional safety for process control).
Usage Methods
1. Installation
- Board-Level Integration (OEM Use):
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- Mount the MVME61006E-0163R to a host system chassis using M3 screws (torque: 3 Nm) with thermal interface material (TIM) between the SBC’s heat spreader and the chassis—critical for heat dissipation in extended-temperature applications.
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- Ensure compatibility with the host system’s power supply (12–24V DC, redundant inputs recommended) and I/O backplane (VMEbus or custom connectors).
- Rugged Enclosure Installation:
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- For standalone use, integrate the SBC into EMEROSN’s RUG-MVME-6100 enclosure (IP65-rated), which includes a fanless thermal management system and EMI shielding. Mount the enclosure to a DIN rail or flat surface using the included brackets.
- Environmental Preparation:
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- Avoid installation near direct heat sources (e.g., power resistors) or corrosive substances (e.g., chemicals in oil refineries). For outdoor use, ensure the enclosure provides protection against water ingress (IP65 or higher).
2. Wiring and Connection
- Power Wiring:
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- Connect the 12–24V DC power supply to the redundant power terminals (J1 and J2) using 1.0mm² twisted-pair cable. Install a 2A inline fuse per power input to protect against overcurrent. For critical applications, use separate power supplies for J1 and J2 to ensure fault tolerance.
- I/O Wiring:
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- Digital/Analog I/O: Use shielded twisted-pair cable (0.5mm²) for connecting sensors/actuators to the I/O terminals (J3–J5). Ground the shield at the SBC end to minimize EMI. Configure digital I/O logic (PNP/NPN) via jumpers on the board or software.
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- Ethernet/CANopen: Connect Ethernet ports (J6–J7) to the network using Cat6a cable (for 1000BASE-T) with shielded connectors. For CANopen (J8), use twisted-pair cable with a 120Ω termination resistor at bus endpoints.
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- Serial Ports: Wire RS485/RS232 ports (J9–J10) to legacy devices using shielded serial cable. For RS485 multi-drop networks, limit the number of nodes to 32 and ensure proper grounding.
- Expansion Wiring:
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- If using the PCI Express slot (J11), connect add-on cards (e.g., GPU, additional Ethernet) and secure them with standoffs to prevent vibration-induced damage. For VMEbus expansion (J12), ensure compatibility with legacy MVME modules (e.g., analog I/O cards) and follow VMEbus termination guidelines.
3. Configuration and Programming
- Software Setup:
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- Install a real-time operating system (RTOS) such as VxWorks 7 or QNX Neutrino, or a lightweight Linux distribution (e.g., Yocto Project with PREEMPT-RT patch) optimized for deterministic performance. EMEROSN provides board support packages (BSPs) with device drivers for all on-board I/O and FPGA functions.
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- Use EMEROSN’s MVME Config Tool (Windows/Linux-compatible) to configure hardware settings: CPU clock speed, I/O voltage levels, and FPGA logic (e.g., custom timing for analog inputs). The tool also supports firmware updates via Ethernet or microSD.
- Application Development:
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- For real-time control: Develop applications in C/C++ using tools like Wind River Workbench (for VxWorks) or Eclipse with GNU Compiler Collection (GCC) (for Linux). Leverage EMEROSN’s software libraries for deterministic task scheduling (≤10µs latency) and I/O access.
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- For legacy compatibility: Use the FPGA to emulate legacy protocols (e.g., VMEbus, MIL-STD-1553) and interface with older industrial systems. EMEROSN provides pre-built FPGA bitstreams for common protocols, or custom bitstreams via its engineering services.
- Testing and Validation:
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- Verify hardware functionality using the MVME Diagnostics Tool, which runs built-in tests for CPU, memory, I/O, and communication interfaces. Check for ECC memory errors, Ethernet packet loss, and analog input linearity.
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- Validate real-time performance by measuring task latency with a logic analyzer (e.g., trigger a digital output from a periodic task and measure the time between trigger and output). Ensure latency remains ≤50µs under full CPU load.
4. Operation and Maintenance
- Startup Verification:
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- Power on the SBC and check the status LEDs (J13): solid green = normal operation; flashing yellow = firmware update mode; solid red = hardware fault. Use the serial console (RS232) to debug boot issues (e.g., corrupted firmware, invalid BSP configuration).
- Real-Time Monitoring:
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- Track key parameters (CPU temperature, memory usage, I/O status) via a remote monitoring tool (e.g., SNMP, Modbus TCP/IP) or local console. Set alarms for abnormal conditions (e.g., CPU temp >80°C, ECC memory errors) to trigger maintenance alerts.
- Maintenance:
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- Monthly: Inspect wiring connections for tightness (especially power and Ethernet cables) and clean dust from the heat spreader with compressed air (pressure ≤30 psi).
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- Quarterly: Back up firmware and configuration files to a secure server. Verify redundant power functionality by disconnecting one power input and confirming the SBC continues operating.
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- Annually: Update the BSP and FPGA firmware via Ethernet (download from EMEROSN’s support portal) to address security vulnerabilities and improve compatibility with new I/O modules. Replace the microSD card (if used for firmware) every 5 years to prevent storage degradation.
System Introduction
The EMEROSN MVME61006E-0163R operates as the embedded computing core in industrial and mission-critical systems, integrating five key functional layers to enable reliable, deterministic performance:
1. Processing Layer
The dual-core CPU and FPGA work in tandem to execute application logic:
- The CPU handles general-purpose computing (e.g., data processing, network communication) and real-time control tasks (e.g., PID loop execution for motor control).
- The FPGA manages time-critical I/O (e.g., analog signal sampling at 1 MHz), custom protocol emulation (e.g., legacy VMEbus), and hardware-level fault detection (e.g., overcurrent monitoring on digital outputs).
2. Memory and Storage Layer
- ECC RAM ensures data integrity for critical calculations (e.g., power grid load balancing), correcting single-bit errors and detecting multi-bit errors to prevent system crashes.
- Industrial-grade eMMC and FRAM provide persistent storage for firmware and configuration data, with FRAM offering unlimited write cycles (ideal for frequent data logging in oil and gas monitoring).
3. I/O and Peripheral Layer
This layer acts as the interface between the SBC and field devices:
- Digital/analog I/O connects to sensors (e.g., temperature probes, pressure transducers) and actuators (e.g., solenoid valves, motor drives), enabling closed-loop control.
- Industrial communication ports (Ethernet, CANopen) facilitate data exchange with upstream systems (e.g., SCADA servers) and downstream devices (e.g., remote I/O modules), supporting both real-time control and non-critical data logging.
4. Environmental Resilience Layer
- Wide-temperature components (e.g., -40°C to +85°C-rated capacitors) and conformal coating on the PCB protect against moisture, dust, and chemical exposure in harsh environments (e.g., chemical processing plants).
- EMI shielding (integrated into the rugged enclosure) and filtered power inputs minimize interference from nearby high-voltage equipment (e.g., industrial motors), ensuring stable operation in noisy electrical environments.
5. Redundancy and Safety Layer
- Redundant power inputs prevent system failure if one power supply fails—critical for applications like nuclear power plant control systems.
- Compliance with IEC 61508 SIL 2 ensures the SBC meets functional safety requirements, with built-in fault detection (e.g., CPU watchdog timers, I/O short-circuit protection) to trigger safe shutdowns in abnormal conditions.
Example System Integration:
In an oil and gas wellhead monitoring system, the MVME61006E-0163R is mounted in a rugged enclosure at the wellsite (exposed to -30°C to +75°C temperatures and 5g vibration). It:
- Reads pressure/temperature data from analog sensors (4–20mA) via its analog inputs.
- Executes a real-time algorithm to detect abnormal pressure spikes (indicating well integrity issues).
- Sends data to a remote SCADA server via Ethernet, with CANopen redundancy for backup communication.
- Triggers a local alarm (digital output) if pressure exceeds safe limits, while logging event data to FRAM for post-incident analysis.
Related Models in the Series
- EMEROSN MVME61006E-0163E: “R” → “E” (European compliance) variant, certified to EN 50155 (railway applications) and IEC 60079-0 (explosion-proof), ideal for European railway or chemical processing systems.
- EMEROSN MVME61006E-0164R: Enhanced memory variant (8 GB DDR4, 64 GB eMMC) with an additional Gigabit Ethernet port, designed for data-intensive applications (e.g., video analytics in aerospace ground support).
- EMEROSN MVME61005E-0163R: Previous-generation (5th-gen) model with a single-core Intel Atom E3825 (1.33 GHz), optimized for low-power applications (≤10W) like remote environmental sensors.
- EMEROSN MVME61006E-0163S: “Safety” variant with IEC 61508 SIL 3 compliance, redundant CPU cores, and dual FPGAs—critical for safety-critical systems (e.g., nuclear power plant control).
- EMEROSN MVME61006E-0163A: Aerospace-grade variant with MIL-STD-810H and DO-178C compliance, extended temperature range (-55°C to +125°C), and radiation-hardened components for satellite ground stations.
- EMEROSN MVME61006E-0163X: Expansion-focused model with 2x PCI Express x4 slots and a VME64x backplane interface, enabling integration with high-performance add-on cards (e.g., GPU for machine vision in robotics).
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