GE D20 EME210BASE-T Passive substrate
GE D20 EME210BASE-T Technical Specification
(RX3i Ethernet Baseplate Module)
Specification
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Attribute
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Detail
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Part Number
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Manufacturer
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General Electric (GE)
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Series
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RX3i PACSystems D20 Series
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Country of Origin
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USA
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Function
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Passive Ethernet Backplane for I/O Modules
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Description
The GE D20 EME210BASE-T is a passive baseplate designed to integrate Ethernet-enabled I/O modules into RX3i PACSystems™ racks. It provides 10/100BASE-TX Ethernet connectivity and power distribution for up to 10 I/O modules (single-slot width). Features integrated magnetics (IEEE 802.3 compliant) and supports hot-swapping in redundant CPU configurations.
Features
- Backplane Design:
- 10-position vertical slot interface (supports VME64x pinout)
- Integrated RJ45 ports (2×) with auto-MDIX and link/activity LEDs
- 5VDC/24VDC isolated power distribution (via PDM connector)
- Connectivity:
- Dual Ethernet ports (switch mode: daisy-chain up to 8 baseplates)
- 3.3V/5V TTL signaling for module communication
- DIN-rail or panel mounting (with alignment guides)
- Robustness:
±4kV ESD protection (IEC 61000-4-2)
-40°C to +85°C operational range
Zinc-alloy EMI shield (EN 55022 Class A)
Electrical Specifications
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Parameter
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Specification
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Ethernet Standards
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IEEE 802.3u (10/100BASE-TX)
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Data Rate
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10/100 Mbps (auto-negotiation)
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Isolation Voltage
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1500V AC (port-to-backplane)
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Power Consumption
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0.8W (standby) / 1.5W (active)
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Termination Resistance
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100Ω ±5% (integrated magnetics)
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Product Properties
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Property
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Specification
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Enclosure Rating
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IP20 (installed in RX3i rack)
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Connectors
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2× RJ45 (front), 96-pin backplane (rear)
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Dimensions
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35.8 × 128 × 150 mm (1.4 × 5.0 × 5.9 in)
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Weight
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450 g (0.99 lbs)
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Material
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FR-4 PCB, nickel-plated copper terminals
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Compliance
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UL 61800-5-1, CE, FCC Part 15
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Compatible Modules
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Module Type
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Example Part Numbers
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Digital I/O
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IC220MDL940, IC220DDT320
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Analog I/O
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IC220ALG230, IC220ARI030
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Communication
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IC220ENT001 (EtherNet/IP)
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Motion Control
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IC220SPM001 (SERCOS interface)
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Key Applications
- Distributed I/O Architectures:
- Machine-level EtherNet/IP™ connectivity (e.g., conveyor controls)
- Remote turbine vibration monitoring stations
- Redundant Systems:
- Pair with CMM321 controller for hot-backup power/cooling plants
- Critical process skids (pharmaceutical batch reactors)
- Legacy Integration:
- Migrate Series 90-30 I/O to PACSystems via IC220BEM001 adapter
⚠️ Critical Installation Notes:
- Slot Sequencing: Install LEFT TO RIGHT (Slot 1→10) – reverse order disrupts addressing.
- Grounding: Bond backplate shield to rack ground stud using AWG 12 wire (<5Ω impedance).
- Ethernet Cabling:
- Use CAT5e+ shielded twisted pair (24 AWG min.) – unshielded cables cause CRC errors.
- Maximum daisy-chain depth: 8 baseplates (exceeding causes packet collision).
- Power Limits:
- Total slot power: 12W max (5VDC) / 48W max (24VDC) – verify PDM capacity.
- Hot-Swap Restriction: Only supported in redundant CPU racks – non-redundant racks require power-down.
- Environmental:
- Maintain >25 mm clearance above/below for airflow
- Condensing environments require COND-X coating (GE Option K4)
- Firmware Note: Baseplate firmware v3.05+ required for IGMP snooping (multicast traffic).
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