TEWS TIP114-10 Product Specification
1. Product Overview
The TEWS TIP114-10 is a high-performance PCI Express (PCIe) Gen 2 x4 interface module designed for industrial embedded computing systems. Specialized in reliable data transfer between host controllers and industrial peripherals, it serves as a critical connectivity bridge in applications such as aerospace test benches, industrial automation control, and defense electronics. By leveraging advanced PCIe technology and rugged design, this module ensures stable and low-latency communication even in harsh operating environments, meeting the stringent requirements of mission-critical systems.
Compliant with international standards including PCIe Base Specification 2.0 and EN 61000-6-2 (industrial EMC), the TIP114-10 features excellent anti-interference performance, wide temperature adaptability, and modular expansion capability. It seamlessly integrates with popular embedded operating systems, providing engineers with a flexible and cost-effective connectivity solution.
2. Technical Parameters & Specifications
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Category
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Details
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Product Model
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TEWS TIP114-10
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Product Type
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PCIe Gen 2 x4 Interface Module
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PCIe Compliance
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PCIe Base Specification 2.0; Gen 2 x4 Lane Configuration
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Data Transfer Rate
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Up to 20 Gbps (5 Gbps per Lane)
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Interface Connectors
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1×PCIe x4 Edge Connector; 2×SFP+ Ports (Fiber Optic)
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Supported Protocols
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TCP/IP, UDP, Raw Ethernet; Custom Protocol Support via API
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Memory Interface
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32 MB Onboard DDR3 SDRAM (Cache for Data Buffering)
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Power Consumption
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Typical: 12 W; Maximum: 15 W (12 V DC from PCIe Slot)
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Environmental Ratings
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Operating Temp: -40°C–85°C; Humidity: 5%–95% (Non-Condensing); Vibration: 10–2000 Hz, 10 g
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Certifications
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PCIe 2.0; EN 61000-6-2; UL 60950-1; CE; RoHS
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3. Key Features
3.1 High-Speed & Deterministic Data Transfer
Built on PCIe Gen 2 x4 architecture, the module delivers a maximum data transfer rate of 20 Gbps, ensuring efficient transmission of large-volume industrial data. The deterministic latency (≤10 μs) design guarantees consistent data transmission delays, which is essential for real-time applications like motion control and high-speed test data acquisition.
3.2 Rugged Industrial Design
Engineered to operate in extreme temperatures (-40°C–85°C) and resist high vibration, the TIP114-10 is suitable for harsh environments such as onboard aerospace systems and industrial factory floors. The SFP+ fiber optic ports provide galvanic isolation and long-distance transmission capability (up to 10 km with single-mode fiber), reducing electromagnetic interference (EMI) risks.
3.3 Flexible Software Integration
The module supports major embedded operating systems including Linux, VxWorks, and Windows Embedded. TEWS provides a comprehensive software development kit (SDK) with APIs for custom protocol development, enabling seamless integration with existing control systems and reducing development cycles.
3.4 Reliable Data Buffering
Equipped with 32 MB onboard DDR3 SDRAM, the module offers dedicated data buffering to prevent packet loss during peak traffic periods. The intelligent cache management mechanism optimizes data flow between the host and peripherals, enhancing system stability in high-throughput scenarios.
4. Related TEWS Products
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TEWS TIP114-20: PCIe Gen 3 x8 interface module with 4 SFP+ ports, supporting up to 64 Gbps data rate for high-end applications.
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TEWS TIP108-10: PCIe Gen 2 x1 interface module with Ethernet ports, a cost-effective solution for low-bandwidth industrial connectivity.
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TEWS TPM100-01: PCIe-based timing and synchronization module, ideal for pairing with TIP114-10 in time-critical systems.
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TEWS TIP220-10: PCIe Gen 2 x4 module with LVDS interfaces, specialized for industrial camera and sensor data acquisition.
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TEWS SDK-TIP: Comprehensive software development kit, providing tools and libraries for TIP series module configuration and application development.
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