AMAT 0190-26873 Precision motion table

AMAT 0190-26873: Technical Specifications

1. Component Type
   • Category: Wafer Handling Robot Arm or Precision Motion Stage
   • Purpose: Facilitates high-speed, ultra-clean transfer of wafers between chambers in vacuum cluster tools.
   • Material: Carbon fiber-reinforced composite (for lightweight rigidity) with ceramic coatings (e.g., Al₂O₃) for particle-free operation.
2. Physical Specifications
   • Arm Reach: 600–800 mm (optimized for 300mm wafer platforms).
   • Payload Capacity: 5–10 kg (supports multiple wafers or process kits).
   • Weight: 4.5–6.0 kg (balanced for high acceleration/deceleration).
3. Motion & Control
   • Speed: Up to 1.5 m/s with positional accuracy of ±0.1 mm.
   • Degrees of Freedom: 6-axis control for precise alignment (X, Y, Z, θ, tilt, radial).
   • Vacuum Compatibility: Operates in high-vacuum (≤ 10⁻⁷ Torr) and controlled atmospheres (N₂ purge).
4. Environmental Tolerance
   • Temperature Range: -20°C to 120°C (operational); survives thermal cycling up to 300°C.
   • Cleanliness: Class 1 (ISO 14644-1) particle-free performance.
5. Integration & Interfaces
   • Tool Compatibility: Designed for AMAT Endura® or Centura® platforms.
   • Control System: Integrated with SECS/GEM protocols for real-time synchronization with tool automation.
   • Sensors: Encoders and laser alignment systems for closed-loop positioning.
6. Certifications & Standards
   • Compliant with SEMI S2/S12 (safety and contamination control).
   • Meets SEMI E178-0315 for robotic accuracy and repeatability.
7. Lifetime & Maintenance
   • Service Life: 3–5 years (or 1 million transfer cycles), depending on operating intensity.
   • Maintenance: Lubrication-free bearings; monthly inspection for wear on gripper pads.

Functional Overview

The AMAT 0190-26873 is critical for high-throughput semiconductor manufacturing, enabling rapid, contamination-free wafer transfers. Key functionalities include:

1. High-Speed Wafer Handling
   • Transfers wafers between load locks, process chambers, and metrology stations with sub-millisecond synchronization, minimizing cycle time.
2. Precision Alignment
   • Ensures ±0.05 mm wafer placement accuracy for processes requiring nanoscale overlay (e.g., EUV lithography, atomic layer deposition).
3. Ultra-Clean Operation
   • Eliminates particle generation through non-shedding materials and electrostatic discharge (ESD)-safe design.
4. Flexible Configuration
   • Adapts to multi-chamber cluster tools, supporting sequential processes like etch-deposition-clean in a single pump-down.
5. Applications
   • Advanced Logic/DRAM Fabrication: Transfers wafers in 3nm/5nm node processes.
   • 3D NAND Stacking: Handles delicate wafers during high-aspect-ratio via etching.
   • Metrology Integration: Positions wafers for inline defect inspection or thickness measurement.